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Applied Materials (AMAT) 0100-11022 Semiconductor Board Card
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Applied Materials (AMAT) 0100-11022 Semiconductor Board Card

Applied Materials (AMAT) 0100-11022 Semiconductor Board Card

U.S.$8760.00
U.S.$7860.00
U.S.$7467.00
U.S.$7309.80
Weight:1.290KG
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Description

Applied Materials (AMAT) 0100-11022 Semiconductor Board Card


AMAT 0100-11022 is a high-precision component typically utilized in Applied Materials (AMAT) semiconductor manufacturing equipment. Specifically,

this part number often refers to an Upper Electrode or Gas Distribution Plate (GDP) used in plasma etch or CVD (Chemical Vapor Deposition) chambers.

Introduction

The AMAT 0100-11022 serves as a critical interface within the reaction chamber. Its primary role is to ensure the uniform distribution of process gases and to maintain stable plasma discharges during the wafer fabrication process.

Manufactured with high-purity materials, it is designed to withstand the harsh, corrosive environments of semiconductor processing while minimizing particle contamination.

Technical Parameter Table

ParameterSpecification
ManufacturerApplied Materials (AMAT)
Part Number0100-11022
MaterialHigh-Purity Silicon / Anodized Aluminum (depending on rev)
Process ApplicationEtch / CVD / PECVD
Operating TemperatureUp to 400°C
Hole ConfigurationPrecision Multi-hole Showerhead Pattern
Compatibility200mm / 300mm Wafer Systems
Surface FinishUltra-low roughness (Ra)

Product Advantages and Features

Superior Gas Uniformity: The engineered hole pattern ensures an even flow of precursors across the entire wafer surface, preventing "hot spots" or uneven etching.

Plasma Stability: Provides a consistent electrical ground or RF feed, leading to repeatable plasma density.

Contamination Control: Built from semiconductor-grade materials to prevent metallic impurities from leaching into the production environment.

Extended Lifecycle: Enhanced resistance to plasma erosion reduces the frequency of "wet cleans" and part replacements.

Application Cases

Dielectric Etching: Used in the creation of vias and trenches in silicon dioxide or nitride layers.

Thin Film Deposition: Ensuring stoichiometric balance during the growth of insulating layers.

Chamber Retrofitting: Employed by fabs looking to maintain OEM standards during scheduled tool overhauls.

Unique Product Description

The AMAT 0100-11022 is more than a simple plate; it is the "lungs" of the process chamber. By balancing fluid dynamics with electromagnetic shielding,

it bridges the gap between raw gas input and microscopic circuit precision. Its unique thermal management properties allow it to remain dimensionally stable even under the intense heat of continuous plasma bombardment.

Related & Other Models in the Series

Applied Materials utilizes a modular numbering system. Often, the 0100-series refers to chamber hardware:

0100-11021: Lower electrode assembly or adjacent insulator.

0100-01055: Standard Gas Box interface components.

0190-series: Frequently associated with gas feed lines and heaters.

0040-series: Ceramic insulators and focus rings.

Installation and Maintenance

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CiscoCSACS-1121-K9
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CLIPPARDR311
CMZSVM1608/SER.000
COEN ISCANDSF-2000-UV  DSF-2000-MB-UV 2653-213-06

Installation

Cleanroom Protocol: Must be unpacked and handled within a Class 10/100 cleanroom environment.

Alignment: Ensure the indexing pin aligns perfectly with the chamber lid to avoid gas bypass.

Torque Specs: Tighten mounting bolts in a star pattern to the manufacturer-specified $N cdot m$ to prevent thermal warping.

Maintenance

Inspection: Check for "crow's foot" cracking or discoloration around the gas holes.

Cleaning: Use only approved chemical baths (e.g., dilute HF or specialized solvent cleans) to avoid stripping the protective anodization.

Replacement: Replace the part once the thickness decreases beyond the specified tolerance or when particle counts exceed fab limits.



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