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AMAT  0190-23623-001  RF Impedance Matching Network
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AMAT 0190-23623-001 RF Impedance Matching Network

AMAT  0190-23623-001  RF Impedance Matching Network

U.S.$7860.00
U.S.$7640.00
U.S.$7258.00
U.S.$7105.20
Weight:1.290KG
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Description

AMAT  0190-23623-001  RF Impedance Matching Network


AMAT     0190-26463  Temperature Controller / Thermal Control Module

Introduction

The AMAT 0190-26463 is a specialized Temperature Controller module manufactured by Yamatake (Azbil) for Applied Materials.

It is a key element in the control infrastructure for 300mm wafer processing platforms, specifically the Centura Silvia and Vantage RadiancePlus systems.

This module is designed to manage complex thermal loops, ensuring that process chambers maintain ultra-stable temperatures during Rapid Thermal Processing (RTP) and other high-temperature deposition cycles.

Its integration with the Yamatake sensing control logic allows for the extreme accuracy required for sub-14nm logic and memory fabrication.

Technical Parameter Table

ParameterSpecification
ManufacturerApplied Materials (AMAT) / Yamatake (Azbil)
Part Number0190-26463
RevisionTypically REV002
Component TypeTemperature Controller / Thermal Control Module
SeriesSilvia / SDC Series
Application PlatformCentura, Vantage RadiancePlus, Endura
WeightApprox. 1.35 kg (2.98 lbs)
Control LogicAdvanced PID Thermal Regulation
CommunicationProprietary AMAT Controller Interface

Product Advantages and Features

Rapid Response Time: Optimized for the high-speed ramp rates characteristic of RTP (Rapid Thermal Processing) systems.

Multi-Zone Stability: Capable of managing localized heating elements to ensure cross-wafer thermal uniformity, which is critical for preventing slip dislocations in silicon.

Low Signal Noise: Engineered to filter out electrical interference from high-power RF generators and plasma sources common in the chamber environment.

Seamless Integration: Fully compatible with AMAT’s Vantage 5.X and Centura control racks, supporting original software handshakes and diagnostic protocols.

Application Cases

Rapid Thermal Processing (RTP): Precise control of lamphead assemblies in the RadiancePlus chamber for annealing, oxidation, and silicidation.

Chamber Wall Heating: Maintaining consistent temperatures on chamber interior walls to prevent precursor condensation and particle generation.

Advanced Logic Fabrication: Ensuring repeatable thermal budgets for sensitive gate-stack deposition in 300mm wafer fabs.

Other Models in the Same Series

The 0190-series includes various modules used within the AMAT control architecture:

Model / Part NumberDescription
0190-222056-Channel Temperature Controller (Silvia)
0190-38517RTP Lamp Bulb Radiance Assembly
0190-22014PVD Dual Mode Heater Driver
0190-15384Delta Tau Data I/O Card

Unique Product Description

The AMAT 0190-26463 represents the pinnacle of thermal precision for the Vantage platform.

While standard industrial controllers manage bulk temperatures, the 0190-26463 is tuned for the "micro-environments" of a vacuum chamber.

Its proprietary algorithms, developed in tandem with Yamatake, allow it to account for the specific thermal lag and radiation characteristics of AMAT heater banks.

For high-volume manufacturing (HVM) environments, this module is an essential safeguard against process drift and wafer yield loss.

Installation and Maintenance

Installation: Verify the revision compatibility (e.g., REV002) with your existing system backplane.

Slide the module into the designated slot in the AC/DC rack and secure the front panel screws to ensure proper grounding.

Calibration: After replacement, a system-level calibration is recommended to synchronize the new controller with the chamber’s specific thermocouple sensors and lamp power profiles.

Maintenance: Regularly inspect the module for diagnostic error codes via the front-panel LEDs or the tool’s HMI. Ensure the controller rack’s cooling fans are operational to prevent the 0190-26463 from overheating.

Handling: This is an ESD-sensitive device. Always use a grounded wrist strap when handling or installing the module to prevent latent damage to the internal CMOS circuitry.



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