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AMAT 0190-24007 CPCI-3720CF Single Board Computer
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AMAT 0190-24007 CPCI-3720CF Single Board Computer

AMAT 0190-24007 CPCI-3720CF Single Board Computer

U.S.$9850.00
U.S.$8960.00
U.S.$8512.00
U.S.$8332.80
Weight:1.290KG
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(Inventory: 1)
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Description

AMAT 0190-24007 CPCI-3720CF Single Board Computer


AMAT 0190-24007: CPCI-3720CF Single Board Computer

The Applied Materials (AMAT) 0190-24007 is a high-performance industrial Single Board Computer (SBC) based on the 3U CompactPCI (cPCI) architecture.

Manufactured by MKS-TENTA (Model CPCI-3720CF or AS03720-23), this module is the primary processing unit for various 300mm semiconductor tool controllers.

It is specifically engineered to handle the high-speed data acquisition and real-time logic required for advanced wafer processing.

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IC660BBA104 Genius 8-Point Discrete I/O   Terminal Base Unit
IC660BBA021 Genius Analog Input Terminal   Base Unit
IC660BBA105 Genius I/O Terminal Base Unit
IC660BBD110 Genius Handheld Bus   Diagnostic & Configuration Tool
IC660BBD101 Genius Bus Diagnostic Tester   / Monitor
IC697CMM742 Genius LAN Communication   Co-processor Module
IC660BPM100 Genius I/O Bus Power Module

Related Models

The 0190-24007 is a centerpiece of the 300mm control system and is frequently integrated with:

0190-24008: High-performance Core-i series SBC (Step-up model).

0190-07450: 48-Channel Digital I/O (AS00710-02).

0190-17894: Interlock Module Conductor (CDN500-37).

0190-16926: 4-Channel DeviceNet Scanner Card.

0190-11817: 16-Port Serial Interface Card.

Application Cases

This processor board is the "intellectual core" for several AMAT platforms:

Reflexion LK / LK Prime: Coordinating the complex polishing and cleaning sequences in high-volume CMP tools.

Producer GT / SE: Managing centralized logic for multi-chamber PECVD or SACVD deposition systems.

Centura AP: Operating as the primary controller for multi-step etch or thermal processing sequences.

Endura 2: Providing the processing power required for real-time robotic trajectory planning and vacuum safety monitoring.

Product Advantages and Features

Compact Reliability: The 3U cPCI form factor provides a rugged, vibration-resistant connection that is significantly more durable than standard commercial PC architectures.

Fanless Thermal Design: Utilizes high-efficiency passive heatsinks, eliminating the risk of mechanical fan failure and preventing particle spread in the cleanroom.

Integrated Boot Solution: The onboard CompactFlash slot allows the tool to boot instantly into a stable, industrial-grade OS (like VxWorks or Windows Embedded).

High Signal Integrity: Engineered to maintain error-free operation even when positioned near high-power RF sources and plasma generators.

Other Models in the Same Series

The 0190-24XXX series represents AMAT's modernized CPU and host processing lineup:

0190-24XXX Series: High-level SBCs and host controllers for 300mm tools.

0190-07XXX Series: Standard cPCI I/O and transition modules.

0190-15XXX Series: Intelligent digital I/O and communication gateway cards.

Installation and Maintenance

Installation: Slide the 0190-24007 into the "System" slot (typically Slot 1) of the cPCI backplane.

Use the injector/extractor handles to firmly seat the board and tighten the captive front-panel screws for grounding.

Firmware/BIOS: Note that specific AMAT tools require proprietary BIOS settings to recognize the storage configuration. Ensure the CF card is seated before power-on.

Maintenance: Regularly inspect the CMOS battery (CR2032). A low battery will cause the tool to lose its boot order, leading to a "System Not Found" error.

Handling: This board is highly ESD sensitive. Always use a grounded wrist strap and anti-static packaging during replacement.

Unique Product Description

The AMAT 0190-24007 is the localized "brain" of the semiconductor production line.

While individual I/O cards handle basic tasks, this CPCI-3720CF board processes the complex mathematical models that keep a 300mm wafer perfectly balanced between chemical gas, plasma, and mechanical polishing.

Its high-density architecture provides a powerhouse of computing in a compact, ruggedized footprint, ensuring that high-volume manufacturing environments can operate with the precision and stability required for the latest technology nodes.


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