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AMAT 2000-21123  Advanced Vacuum Seal Assembly
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AMAT 2000-21123 Advanced Vacuum Seal Assembly

AMAT 2000-21123  Advanced Vacuum Seal Assembly

U.S.$7860.00
U.S.$6980.00
U.S.$6631.00
U.S.$6491.40
Weight:1.290KG
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(Inventory: 2)
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Description

AMAT 2000-21123  Advanced Vacuum Seal Assembly


AMAT 2000-21123: Advanced Vacuum Seal Assembly

The AMAT 2000-21123 is a precision-engineered Vacuum Seal or Gasket Assembly utilized within the high-vacuum process chambers of Applied Materials (AMAT) semiconductor fabrication equipment.

It is primarily designed for the Centura and Endura platforms, serving as a critical barrier to maintain ultra-high vacuum (UHV) integrity during plasma-enhanced deposition and etching processes.

Technical Parameter Table

ParameterSpecification
ManufacturerApplied Materials (AMAT)
Part Number2000-21123
Component TypeVacuum Seal / Door Gasket Assembly
MaterialHigh-Grade Fluoroelastomer (Chemraz/Kalrez equivalent)
CompatibilityCentura, Endura, and Producer Chambers
Vacuum Rating$1 times 10^{-9}$ Torr
Operating TempUp to 280°C (Process dependent)
ComplianceSemiconductor Grade (Low Outgassing)

Product Advantages and Features

Superior Chemical Resistance: Specifically formulated to resist degradation from aggressive process gases like $NF_3$, $CF_4$, and $Cl_2$.

Low Particle Generation: High-purity material construction minimizes "shedding" or particle flaking, which is essential for maintaining high wafer yields.

Extreme Thermal Stability: Maintains elasticity and sealing force even after thousands of high-temperature cycles.

Precision Fit: Engineered to the exact tolerances of AMAT chamber slits and load locks, preventing micro-leaks that can cause process shifts.

Unique Product Description

The AMAT 2000-21123 is more than just a seal; it is the primary line of defense for the vacuum environment.

In the nanometer-scale world of chip manufacturing, even a single molecule of atmospheric oxygen can ruin a batch of wafers.

This assembly utilizes advanced cross-linked polymer technology to provide a "zero-leak" interface, ensuring that the process chemistry remains pure and the chamber environment remains isolated from external contaminants.

Application Cases

Load Lock Sealing: Ensuring a tight seal between the atmospheric wafer transfer robot and the vacuum transfer chamber.

Chamber Gate Valves: Acting as the primary seal for slit valves where wafers enter the process module.

CVD/PVD Processing: Maintaining vacuum integrity during high-energy plasma deposition where pressure control is critical.

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Other Models in the Same Series

2000-21124: A larger diameter variant for wide-entry slit valves.

2000-01000 Series: Various O-ring and static seal kits for gas delivery lines.

0010-XXXXX: Mechanical valve assemblies that often incorporate the 2000-21123 seal.

Installation and Maintenance

Handling: Always use powder-free, cleanroom-grade gloves. Skin oils can cause outgassing issues in high-vacuum environments.

Surface Preparation: Before installation, ensure the sealing surface (groove) is cleaned with Isopropyl Alcohol (IPA) and is free of scratches.

Lubrication: If required by the specific AMAT maintenance manual, apply a microscopic layer of vacuum grease (e.g., Krytox); however, many modern UHV seals are designed to be installed dry.

Inspection: During PM (Preventive Maintenance), check for "compression set" or hardening. If the seal does not return to its original shape, it must be replaced to prevent sudden vacuum failure.



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