Kongsberg d0000930 presafe-atex-report signed

IEC60079-15 Test report.

Clause 7.2 Thermal endurance:

Clause 26.8 & 26.9 Thermal endurance to heat & cold. Modified tests according to Table 1 of IEC60079-15:

2010. Thermal endurance tests documented in Appendix B.3 of the associated IEC60079-15 Test report.

Non-metallic assembly part of investigated modules (Mounting frame for PCB) is considered to be part of

enclosure in the end use. The used non-metallic material is ZYTEL Nylon resin type FR72G25V0. V-0. RTI=

120°C (Imp), CTI code 2. UR E41938.

Table 26.8 Thermal endurance to heat P 2)

Part tested Test condition Remark

DUT 1) Climatic conditioning in 672h at 80°C & 90% RH. 3) No visible deterioration of material.

Supplementary information:

1) Four I/O modules and three separate K1 relay of module EFI-16 tested, RCU502 & RMP420 &

RAIV400 & EFI16 & K1 relays. Results are representative for all modules which are included in the

investigation.

2) Thermal endurance to heat test is modified according to requirements of cl. 22.3.1 of IEC60079-15:

2010

3) Built-in I/O modules tested. No cabinets included in the investigation. Maximum service temperature is

determined in associated IEC60079-15: 2010 test report. However taking into account the end

application where mounting condition and environmental influences might have impact on the end use,

maximum service temperature is based on the stated ‘Specific condition of use’.

Table 26.9 Thermal endurance to cold P

Part tested Test condition Remark

DUT 1) Climatic conditioning in 24h at -30°C. No visible deterioration of material.

Supplementary information:

1) Four I/O modules tested, RCU502 & RMP420 & RAIV400 & EFI16. Results are representative for all

modules