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AMAT 0100-00582 Gas Panel Controller Backplane
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AMAT 0100-00582 Gas Panel Controller Backplane

AMAT 0100-00582 Gas Panel Controller Backplane

U.S.$6570.00
U.S.$4577.00
U.S.$4348.15
U.S.$4256.61
Weight:1.290KG
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Description

AMAT 0100-00582 Gas Panel Controller Backplane


AMAT 0100-00582 Gas Panel Controller Backplane

This comprehensive technical guide details the Applied Materials (AMAT) 0100-00582. a critical backplane assembly designed for 300mm semiconductor gas delivery systems.

1. Product Introduction

The AMAT 0100-00582 is a Gas Panel Controller Backplane PCB.

It acts as the central communication and power distribution hub for the gas delivery panel in 300mm wafer processing tools. 

This backplane allows multiple controller cards, mass flow controllers (MFCs), and sensor modules to interface seamlessly with the main tool controller.

Its robust design is engineered to handle the high-speed data and power requirements necessary for precise chemical delivery in advanced semiconductor fabrication.

2. Technical Parameter Table

ParameterSpecification Details
ManufacturerApplied Materials (AMAT)
Part Number (P/N)0100-00582
Model NumberGas Panel Controller Backplane
FAB Number0110-00582
System CompatibilityAMAT 300mm Platforms (Endura, Centura, Producer)
Component TypeBackplane Printed Circuit Board (PCB)
Board RevisionRev. 001 (Typical)
Country of OriginUSA
DimensionsApprox. 12" x 12" (Shipping footprint)
WeightApprox. 1.36 kg (3 lbs)

3. Related Models & Same Series

The 0100-series backplanes and PCBs are specific to the 300mm tool architecture:

0100-00584: PCI Tip Chamber Backplane (300mm).

0100-00590: Mainframe Distribution PCB Assembly.

0100-00611: Smoke and Water Leak Detector PCB Assembly.

0100-00634: Dual Gas Lock Detector Module.

4. Application Cases

Gas Delivery Systems: Providing the electrical backbone for gas panels that regulate etching gases and deposition precursors.

300mm Wafer Fabrication: Used in the transition to larger wafer sizes where high-density backplanes are required for complex gas mixing ratios.

Process Automation: Synchronizing digital and analog signals between the gas box and the tool’s central processing unit for real-time flow adjustment.

5. Product Advantages and Features

High Reliability: Manufactured to MIL-spec standards to ensure continuous operation in high-uptime fab environments.

Precision Distribution: Minimizes signal cross-talk and power fluctuations, ensuring that MFCs receive clean power for accurate gas metering.

Modular Architecture: The backplane design allows for rapid replacement of individual controller cards without dismantling the entire gas panel.

Corrosion Resistance: PCB coatings are optimized to resist the trace corrosive atmospheres sometimes present near gas delivery hardware.

6. Installation and Maintenance

Installation: Ensure the gas panel power is completely locked out (LOTO).

Align the backplane with the guide ribs on the rack stem to prevent pin damage. Use grounded anti-static equipment (ESD protection) throughout the process.

Maintenance: Periodically inspect the multi-pin connectors for signs of thermal stress or oxidation. Dust accumulation should be removed using dry, compressed air to prevent short circuits between high-density traces.

VAT65040-PACV-AYU2/9049
VAT65040-PACV-AYU2
VIBRACKVK5488E-107S
VIBRO200-560-000-016
VIBRO200-595-002-011
VIBRO573-935-202C
VIBRO200-582-915-032   VM600
VIBRO200-560-000-113   VM600
VIBRO200-566-000-012
VIBROVM600   IOC16T 200-565-000-013 200-565-101-013
VIBRO METERVM600   MPC4 PNR200-510-070-113
Vibro meterIOCN   200-566-000-113
VIBRO METERVM600   MPC4 200-510-111-034
     200-510-070-113
Vibro-meterVM600   CMC16
Vibro-meterVM600   RPS6U

Handling: Avoid touching the gold-plated contact points with bare hands; skin oils can lead to long-term connectivity issues.

7. Unique Product Description

The AMAT 0100-00582 is the "nervous system" of the 300mm gas panel.

In the delicate environment of semiconductor manufacturing, the ability to control gas flow with absolute repeatability is the difference between a functional chip and a wasted wafer.

This backplane provides the structural and electrical integrity required to manage dozens of variables simultaneously, ensuring that the 300mm platforms remain the gold standard for global chip production.



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